ICMSSM 2024 is the 9th edition in this series of conferences started in 2013 that are devoted to around the design and analysis of mechanical structures that incorporate smart materials. ICMSSM is a famous event worldwide that covers many dimensions of adaptive structural design, smart materials for intelligent sensing and monitoring systems, energy harvesting and storage, vibration control and damping, biomechanics. Following the traditions of previous successful ICMSSM conferences held in Xiamen, China in 2013; Kuala Lumpur, Malaysia in 2014; Nanjing, China in 2016; Shenzhen, China in 2018; Xi'an, China in 2019; Ho Chi Minh City, Vietnam in 2020; Changsha, China in 2021; and most recently, a virtual gathering in Bangkok in 2023. All accepted full papers will be published in IOP Conference Series: Journal of Physics (JPCS) and submitted for major indexing service like EI-Compendex, SCOPUS and etc. Keynote Speakers Assoc. Prof. Ching Yern Chee, Universiti Malaya, Malaysia Prof. Sinin bin Hamdan, Universiti Malaysia Sarawak, Malaysia Prof. Yan Zhuge, UniSA STEM, University of South Australia, Australia Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore Prof. Daolun Chen, Toronto Metropolitan University, Canada Prof. Alan Kin Tak, Technological and Higher Education Institute of Hong Kong Prof. Zhili Dong, Nanyang Technological University, Singapore

 会议主题

感兴趣的提交主题包括但不限于：

T1：机械科学与技术进展

T2：智能结构和系统

T3：智能材料和表面

T4：材料制造与加工

T5：研究、分析和建模方法

 Submission method

1、Submit by system: https://icmssm.org/openconf/openconf.php  

2、Email: cfp@icmssm.org