Description

=Publication= The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc. ***ICICM2016-2023 has been successfully indexed by EI Compendex and Scopus already! ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ICICM2023 | Nanjing on October 20-23, 2023

Call For Papers

★Co-Sponsored by

==Southeast University, China

==University of Electronic Science and Technology of China, China

==Wuhan University of Technology, China

 

==Submission==

1. Full paper (publication and presentation)

2. Abstract (presentation only)

**Electronic submission system: https://easychair.org/conferences/?conf=icicm2024

**Email submission:  icicm_conf@vip.163.com

More detail about submission, please visit at http://icicm.net/submission.html

 

=Topics (include but not limit)=

► Devices and Circuits for Wirless System

► Application Specific Circuits and Systems for Communication

► Digital, Analog, Mixed Signal IC and SOC design technology

► Silicon integrated circuits and manufacturing

► Low-power, RF devices & circuits

► IC Computer-Aided –Design technology, DFM

► Silicon/germanium devices and device physics

► Interconnect, Low K, High K and other process technologies

► Unconventional and nano-electronics

► Organic semiconductor devices and technologies    

► Compound semiconductor devices and circuits

► Displays, sensors and MEMS     

► Semiconductor materials and material characterization

► Packaging and testing technology     

► Solar cell & other devices for new energy sources

► Modeling and simulation   

► Equipment technology

► Reliability   

► Displays, sensors and MEMS

► Advance memories technology

For more topics, please visit at: http://icicm.net/call-for-papers.html

 

==Organizing Committee==

**Advisory Chairs

Pui-in Mak, University of Macau, Macau, China

Ljiljana Trajkovic, Simon Fraser University, Canada

 

**Conference Chairs

Zhigong Wang, Southeast University, China

Chen Liu, Nanjing University of Posts and Telecommunica􀆟ons, China

 

**Conference Co-Chairs

Yufeng Guo, Nanjing University of Posts and Telecommunica􀆟ons, China

Letian Huang, University of Electronic Science and Technology of China, China

 

**Program Chairs

Zhikuang Cai, Nanjing University of Posts and Telecommunica􀆟ons, China

Junyong Deng, Xi'an University of Posts & Telecommunica􀆟ons

 

**Program Co-Chairs

Zhixiong Di, Southwest Jiaotong University, China

Delong Shang, Ins􀆟tute of Microelectronics of the Chinese Academy of Sciences, China

Abdel-Hamid Ali Soliman, Staffordshire University, UK

Alex Yakovlev, Newcastle University, UK

 

**Program Committee

Lu Zhu, Sun Yat-sen University, China

Youming Zhang, Southeast University, China

Weiguang Sheng, Shanghai Jiao Tong University, China

Haizhi Song, University of Electronic Science and Technology of China,China

Hao Gao, Austria & Eindhoven University of Technology, The Netherland

Yun Fang, Silicon Austria Labs, Austria

Jeff Kilby, Auckland University of Technology, New Zealand

 

**Student Program Chairs

Shiheng Yang, University of Electronic Science and Technology of China, China

Chao Fan, Xi'an Jiaotong University, China

 

**Special Session Chairs

Chen Yang, Xi'an Jiaotong University, China

Jianshi Tang, Tsinghua University, China

Yuan Du, Nanjing University, China

 

**Academic Committee Chairs

Jin He, Peking University, China

Fanyi Meng, Tianjin University, China

 

**Academic Committee

Kailin Ren, Shanghai University, China

Yuanyuan Shi, University of Science and Technology of China, China

Minghui Li, University of Glasgow, UK

Wang Nan, Dalian University of Technology, China

Wu Gao, Northwestern Polytechnical University, China

 

**Publicity Chairs

Huizhen Qian, University of Electronic Science and Technology of China, China

Qiang Wu, Southwest Jiaotong University, China

Jia Wang, Northwestern Polytechnical University, China

Dengquan Li, Xidian University, China

Pakornkiat Sawetmethikul, Rajamangala University of Technology Thanyaburi, Thailand

Wei Ren, Xi’an University of Posts and Telecommunications, China

 

=CONTACT US=

Ms. Jenny Chow

Email: icicm_conf@vip.163.com

Web: http://icicm.net/

Tel: (86)134-0855-5552