→Topics

3D Process and Integration Technologies

Substrate Embedding & Advanced Flip-Chip Packaging

MEMS & Sensor Technologies

Wafer-Level CSP & Heterogeneous Integration

Design and Analysis of Power Delivery Systems

Novel Materials, Devices and 3D Interconnects

Wearable, Flexible, and Stretchable Electronics

Optical Interconnects & 3D Photonics

Digital System and Logic Design

Computer Architecture and VLSI

Networked-Driven Multicore Chips

Advance Robotics Systems

Electrical Machines

Analog and Digital Electronics

Signals and Systems

For more topics, please check：http://www.icecc.org/cfp.html

→Submission Guideline

1. Submission Requirements

♦ Language

English is the official language of the conference. The paper should be written and presented only in English.

♦ Publication & Presentation

Full paper (at least 8 pages) submission is required if you consider publishing your paper.

♦ Presentation Only

Abstract (200-400 words) submission is acceptable for presentation only at ICECC 2022.

♦Paper Length

Each paper should have 8 pages at least. A regular registration can cover a paper within 10 pages and more pages will be charged at 60 USD/page. Please well format your paper according to the template before submission.

♦How to submit?

Send to official email directly: icecciacsit.net. or submit via Online submission system: http://confsys.iconf.org/submission/icecc2022

→Contact

Conference secretary: Ms. Reina Wang

Email: icecciacsit.net

WeChat: iacsit2009

Tel: +86-18302820449

Office Hour: 9:30-18:00

Monday to Friday (GMT+8)