→Publication All papers will be strictly double blind reviewed by the program committee, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings Series by ACM (ISBN: 978-1-4503-9584-7), which will be archived in the ACM Digital Library, and indexed by Ei Compendex, Scopus, etc.

Call For Papers


3D Process and Integration Technologies

Substrate Embedding & Advanced Flip-Chip Packaging

MEMS & Sensor Technologies

Wafer-Level CSP & Heterogeneous Integration

Design and Analysis of Power Delivery Systems

Novel Materials, Devices and 3D Interconnects

Wearable, Flexible, and Stretchable Electronics

Optical Interconnects & 3D Photonics

Digital System and Logic Design

Computer Architecture and VLSI

Networked-Driven Multicore Chips

Advance Robotics Systems

Electrical Machines

Analog and Digital Electronics

Signals and Systems

For more topics, please check:

→Submission Guideline

1. Submission Requirements

♦ Language

English is the official language of the conference. The paper should be written and presented only in English.

♦ Publication & Presentation

Full paper (at least 8 pages) submission is required if you consider publishing your paper.

♦ Presentation Only

Abstract (200-400 words) submission is acceptable for presentation only at ICECC 2022.

♦Paper Length

Each paper should have 8 pages at least. A regular registration can cover a paper within 10 pages and more pages will be charged at 60 USD/page. Please well format your paper according to the template before submission.

♦How to submit?

Send to official email directly: or submit via Online submission system:


Conference secretary: Ms. Reina Wang


WeChat: iacsit2009

Tel: +86-18302820449

Office Hour: 9:30-18:00

Monday to Friday (GMT+8)