==Submission email:icicmyoung.ac.cn (Or you still can submit to the submission system on website)

==Find the tempalte with the link: http://icicm.net/Template.doc (Word) http://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex)

★Keynote Speakers

Prof. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, Canada

Prof. Fei Yuan，Ryerson University, Canada

★Invited Speakers

Prof. Sheng-Lyang Jang,National Taiwan University of Science and Technology, Taiwan

Prof. Dai Yong-Sheng,Nanjing University of science & Technology, China

★ICICM Committees

Advisory Chair

Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada

Conference Chairs

Prof. Zhigong Wang, Southeast University, China

Prof. Li Qiang, University of Electronic Science and Technology of China, China

Prof. Gene Eu Jan, National Taipei University, Taiwan

Program Chairs

Prof. Fei Yuan, Ryerson University, Canada

Prof. Zou Zhuo, Fudan University, China

Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden

Assoc. Prof. Keping Wang, Southeast University, China

Steering Committee Chairs

Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China

Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan

Technical Committee

Prof. Xiaoxiao Wang, BeiHang University, China

Prof. Bo Yan, University of Electronic Science & Technology of China, China

Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India

Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia

…

For more members, please visit conference website: http://www.icicm.net/committee.html

★History

Papers of ICICM2019 can be checked in IEEE Xplore!

Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

★Topics

Digital, Analog, Mixed Signal IC and SOC design technology

Silicon integrated circuits and manufacturing

Low-power, RF devices & circuits

IC Computer-Aided –Design technology, DFM

Silicon/germanium devices and device physics

Interconnect, Low K, High K and other process technologies

Unconventional and nano-electronics

Organic semiconductor devices and technologies

Compound semiconductor devices and circuits

Displays, sensors and MEMS

Semiconductor materials and material characterization

Packaging and testing technology

Solar cell & other devices for new energy sources

Modeling and simulation

Equipment technology

Reliability

Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM，ReRAM, MRAM etc.)

★Support

1, Technical Support from IEEE

2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

★Conference Schedule

1) October 23, 2020—Registration & Material Collecting

2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations

3) October 25, 2020—Papers Presentations

★Conference Contact

Ms Daisy Tseng

Email: icicmyoung.ac.cn

Tel: +86-28-87777577