Description

Publication: Accepted and presented papers will be published into ICSP 2019 conference proceedings by IEEE, which will be submitted and reviewed by Ei Compendex and Scopus Index.

Call For Papers

Honorary Chair:

  • Prof. Hai Liu, Shandong University at Weihai, China

Advisory Committees:

  • Prof. Yingchang Liang, University of Electronic Science and Technology of China, China
  • Prof. Albert WANG, University of California, USA

Local Organizing Chair:

  • Prof. Ruolun Liu, Shandong University at Weihai, China

Local Organizing Secretary:

  • Assoc. Prof. Chengyou Wang, Shandong University at Weihai, China

Program Chair:

  • Prof. Tianshu Qu, Peking University, China

International Conference Technical Committees:

  • Prof. MyoungBeom Chung, Sungkyul University, South Korea
  • Prof. Daniel Thalmann, École polytechnique fédérale de Lausanne, Switzerland
  • Prof. Tetsuya Shimamura, Saitama University, Japan
  • Prof. Aleksandr Cariow, West Pomeranian University of Technology, Szczecin, Poland
  • Assoc. Prof. Dr. Matsumoto Mitsuharu, University of Electro-communications, Japan

Agenda Overview:

  • September 28, 2019  Conference Check in and Materials Collection 
  • September 29, 2019  Keynote Speeches&Plenary Speech&Parallel Sessions 
  • September 30, 2019 Academic Visiting or One day tour (Optional)

Contacts:

Ms. Teri Zhang 

Email:  ipmv_conf@yeah.net   

Tel: +86-13096333337