Publication Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection. Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507) Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779) Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752) Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795) Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc. History ICMDA 2025: Vol. 1162. Materials Science Forum-ISBN: 978-3-0364-0958-0 | Indexed by Scopus ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7 | Indexed by Scopus ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7 | Indexed by Scopus ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7 | Indexed by Scopus ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1| Indexed by Ei Compendex & Scopus ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7 | Indexed by Ei Compendex & Scopus ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9 | Indexed by Ei Compendex & Scopus ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0 | Indexed by Ei Compendex & Scopus

Conference Committee

Conference Chair

Takashige Omatsu, Chiba University, Japan

Program Chairs

Masahiro Nomura, The University of Tokyo, Japan

Kwang Leong Choy, Duke Kunshan University, China

Technical Program Chairs

Yoshio Kobayashi, Ibaraki University, Japan

Anatoly Zinchenko, Nagoya University, Japan

Tomoya Oshikiri, Tohoku University, Japan

Publicity Committee

Masayuki Nishi, Kyoto University of Advanced Science, Japan

Pengyong Hoo, Universiti Malaysia Perlis (UniMAP), Malaysia

Mohanad Alabdullah, Deakin University, Australia

Yu-Chih Tzeng, National Central University, Taiwan, China

More info about conference Committees: https://icmda.org/com.html

Submission Methods

System Submission: https://confsys.iconf.org/submission/icmda2027

Email Submission: icmdacbees.net

For more details, you can learn through: https://icmda.org/sub.html

Call for Papers

Track 1: Materials Design and Computational Engineering

Track 2: Advanced Functional Materials and Systems

Track 3: Materials Processing and Manufacturing Technologies

Track 4: Materials Characterization, Performance and Reliability

Track 5: Sustainable Materials and Energy Technologies

Track 6: Materials Applications for Intelligent and Emerging Engineering

For more information, please visit: http://www.icmda.org/cfp.html

Contact Us

Conference Secretary: Ms. Lynn

Email: icmdacbees.net

Tel: +852-3155-4897/+86-28-87577778

Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)