Committee

■ Life Honorary Chair

Yangyuan Wang, Peking University, China

■ Advisory Committee Co-Chairs

Ting-Ao Tang, Fudan University, China

Cor Claeys, Proximus, Belgium

Mengqi Zhou, IEEE China Council, China

■ General Chairs

Jan Van der Spiegel, University of Pennsylvania, USA

Bin Zhao, IEEE EDS, USA

Francois Rivet, University of Bordeaux, France

Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

■ General Co-Chairs

Ning Xu, Wuhan University of Technology, China

Cheng Zhuo, Zhejiang University, China

Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Gaofeng Wang, Hangzhou Dianzi University, China

■ Technical Program Committee Chairs

Haruo Kobayashi, Gunma University, Japan

Ming Li, Peking University, China

Bo Zhang, University of Electronic Science and Technology of China, China

Yi Zhao, Huada Semiconductor

■ Technical Program Committee Co-Chairs

Bei Yu, The Chinese University of Hong Kong, China

Zheng Wang, University of Electronic Science and Technology of China, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia

Ling Zhang, Zhejiang University, China

Chaoyu Yang, Peking University, China

Jing Jin, Shanghai Jiao Tong University, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

■ Local Arrangement Chair

Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

■ Subcommittee Chairs

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Jing Jin, Shanghai Jiao Tong University, China

Chaoyu Yang, Peking University, China

■ Subcommittee Co-Chairs

Hailong Jiao, Peking University, China

Zheng Wang, University of Electronic Science and Technology of China, China

Jin Wei, Peking University, China

Zhihao Yu, Nanjing University of Posts and Telecommunications, China

■ Special Session Chair

Haimeng Huang, University of Electronic Science and Technology of China, China

■ Tutorial Chair

Wei Mao, Xidian University, China

■ Industry Liaison Chairs

Sylvain Eimer, Truth Equipment, China

Preet Yadav, NXP Semiconductors, India

■ Publicity Co-Chairs

Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

■ Publication Committee Chair

Mengqi Zhou, IEEE China Council, China

■ Publication Committee Co-chairs

Lobna A. Said, Nile University, Egypt

Guoqing Deng, Sichuan Institute of Electronics, China

■ Treasurer

Jianhong Zhou, Xihua University, China

■ Secretary General

Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Technical Program Committee

Teme 1: Digital & System Level IC

Chair: Yuchao Yang, Peking University, China

Co-Chair: Hailong Jiao, Peking University, China

■ Track 1: Digital Architectures & Systems

Chair:

Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs:

Yaoyu Tao, Peking University, China

Hongyang Jia, Tsinghua University, China

■ Track 2: Digital Circuits

Chair:

Yongpan Liu, Tsinghua University, China

Co-Chairs:

Yanan Sun, Shanghai Jiao Tong University, China

Fengbin Tu, Hong Kong University of Science and Technology, China

■ Track 3: Design Methodology & EDA

Chair:

Jun Yang, Southeast University, China

Co-Chairs:

Yibo Lin, Peking University, China

Yu Li, Zhejiang University, China

Teme 2: Analog

Chair: Jing Jin, Shanghai Jiao Tong University, China

Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

■ Track 4: RF & Wireless

Chair:

Keping Wang, Tianjin University, China

Co-Chairs:

Jian Pang, Shanghai Jiao Tong University, China

Kai Tang, Hunan University, China

■ Track 5: Wireline

Chair:

Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs:

Bingyi Ye, East China Normal University, China

Yuekang Guo, Shanghai Jiao Tong University, China

■ Track 6: General Analog

Chair:

Lin Cheng, University of Science and Technology of China, China

Co-Chairs:

Junmin Jiang, Southern University of Science and Technology, China

Ang Hu, Huazhong University of Science and Technology, China

Teme 3: Devices

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

Co-Chair: Jin Wei, Peking University, China

■ Track 7: CMOS Logic Devices & Sensors

Chair:

Heng Wu, Peking University, China

Co-Chairs:

Wang Kang, Beihang University, China

Xiaosheng Zhang, University of Electronic Science and Technology of China, China

■ Track 8: Power Devices & Power IC

Chair:

Long Zhang, Southeast University, China

Co-Chairs:

Jiafei Yao, Nanjing University of Posts and Telecommunications, China

Zekun Zhou, University of Electronic Science and Technology of China, China

■ Track 9: Device Reliability & Security

Chair:

Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

Junmin Jiang, Southern University of Science and Technology, China

Zhao Qi, University of Electronic Science and Technology of China, China

Teme 4: Process & Technologies

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

■ Track 10: Semiconductor Process Technologies

Chair:

Bobo Tian, East China Normal University, China

Co-Chairs:

Min Liao, Xidian University, China

Li Zhu, Nanjing University of Posts and Telecommunications, China

■ Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

Ming Xu, Huazhong University of Science and Technology, China

Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

■ Track 12: Packaging Technologies

Chair:

Jun Zhang, Nanjing University of Posts and Telecommunications, China

Co-Chairs:

Shenyang Mo, NARI Semiconductor R&D Center, China

Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

Conference Scope

The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas)

Theme 1: Digital Architectures & Systems

■ Track 1：Digital Integrated Circuits & Systems

FPGA Circuits Design & Application

Processors, Accelerators & SoCs

Memory System & Process in Memory

System Level Testability & Reliability

■ Track 2：Digital Circuits

Digital Blocks

Logical/Physical-Level Security

Non-volatile Memory & Volatile Memory

Circuit Level Reliability Design

■ Track 3：Design Methodology & EDA

Design for Testability, Reliability & Manufacturability

Modeling，Simulation & Emulation

Design & Technology Co-Optimization

Artificial Intelligence Algorithms for EDA

Theme 2: Analog

■ Track 4：RF & Wireless

Building Blocks at RF, mm-wave and THz

Rx, Tx or TRx for Wireless Systems

Wireless Sensor, Radar, Imager

Device/Packaging/Modeling at RF, mm-wave and THz

■ Track 5：Wireline

Electrical/Optical Transmitters/Receivers for Wireline

Clock Generation and Distribution Circuits

Building Blocks for High-Speed Wireline Communications

■ Track 6：General Analog

Advanced Analog Circuits

High-Speed, High-Precision Data Converters

Imagers, Medical Devices & Display Systems

Efficient Power Management Circuits

Theme 3: Devices

■ Track 7：CMOS Logic Devices & Sensors

Advanced CMOS Logic Devices

2D & Thin Film Devices & Technologies

Flash & Non-Volatile & 3D Memory Technologies

Sensor, Sensing Microsystem, MEMS, and Bioelectronics

Smart/Intelligent Sensors & Actuators

Device Modeling & Simulation

■ Track 8：Power Devices & Power IC

Silicon-based Power Devices

Wide Bandgap Power Devices

Power Integrated Circuits、modules & Systems

Power Integrating & Packaging Technology

Power Device Reliability

Power Device Modeling & Simulation

■ Track 9：Device Reliability & Security

Back-End of Line Reliability & ESD

Aging & Remaining Useful Lifetime Prediction

PUF & Hardware Security

Devices Radiation Reliability

Theme 4: Process & Technologies

■ Track 10：Semiconductor Process Technologies

Compound Semiconductor Materials & Technologies

Advanced Memory Materials & Technologies

Advanced Process Technologies

Advanced Interconnect Technologies

Process Modeling & Simulation

■ Track 11：Optoelectronics and Silicon Photonics Integration

High-Speed Optoelectronic Devices

Silicon Photonics & Integration

Photonic Sensors & Image Sensors

Optical Computing Devices

Display Process & Integration

■ Track 12：Packaging Technologies

2.5D & 3D Integration

Heterogeneous Integration Packaging

Advanced Wire Bonding Technology

Modeling and Simulation for Advanced Packaging

Testing and Reliability in Advanced Packaging

Paper Submission

Prospective authors are requested to submit at least 3 pages camera-ready full length paper in English. Accepted papers will be included in conference proceedings.

■ On-line submission at http://www.icsict.org

■ Download the Paper Template through https://www.icsict.org/ICSICT_Paper_Template.docx

Call for Special Sessions

The ICSICT 2026 organizing committee invites proposals for special sessions to complement the regular program with emerging topics of interest, featuring state-of-the-art research from academia and industry.

■ Submit Proposal to: ieeeicsictoutlook.com

■ Download Proposal Template through https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx

Contact Us

Conference Secretary: Ms. Joyce

Phone: +86-186 282 638 76

Email: icsict2026csj.uestc.edu.cn | ieeeicsictoutlook.com