◆Organizing Committees

Honorary Chair

Xin Cheng, Southern University of Science and Technology, China

Advisory Chairs

Yang Chai (Fellow of IEEE), The Hong Kong Polytechnic University, Hong Kong, China

Anquan Jiang, Fudan University, China

Hongming Chen, Zhejiang Ocean University, China

Conference Chairs

Xiaoqing Wen, Kyushu Institute of Technology, Japan (Fellow of IEEE)

Keping Wang, Tianjin University, China

Hao Yu, Southern University of Science and Technology, China

Program Chairs

Bo Liang, Zhejiang University, China

Lianming Li, Southeast University, China

Yunfang Jia, Nankai University, China

Fengwei An, Southern University of Science and Technology, China

Xiaobing Yan, Hebei University, China

Program Co-chairs

Ben Abdallah Abderazek, University of Aizu, Japan

Wenhua Gu, Nanjing University of Science and Technology, China

Zhen Wen, Soochow University, China

Yanli Zou, Guangxi Normal University, China

For more committees, please kindly visit it via: https://www.iceda.org/com.html

◆Keynote Speakers

Prof. Yang Chai

Chair Professor of Semiconductor Physics

Associate Dean of Faculty of Science (Research)

The Hong Kong Polytechnic University, Hong Kong, China

IEEE Fellow, IEEE Distinguished Lecturer, Associate Editor of ACS Nano

Prof. Anquan Jiang

Fudan University, China

◆Invited Speakers

Prof. Kumar T. Nandha

The Univerisity of Nottingham Malaysia Campus, Malaysia

Asst. Prof. Can Li

The University of Hong Kong, Hong Kong, China

◆Topics (Topics of interest for submission include, but are not limited to:)

Track 1: Semiconductor Devices & Materials

▪ Advanced semiconductor materials (SiC, GaN, 2D materials)

▪ High-performance transistors (FinFET, GAA, TFET)

▪ Power semiconductor devices and modules

Track 2: Integrated Circuits & VLSI Design

▪ Analog/mixed-signal IC design

▪ RF and millimeter-wave integrated circuits

▪ Low-power and energy-efficient ICs

Track 3: Optoelectronics & Photonic Devices

▪ Photodetectors and image sensors

▪ LEDs, lasers, and display technologies

▪ Silicon photonics and plasmonics

Track 4: Power Electronics & Energy Devices

▪ Power converters and inverters

▪ Energy harvesting devices and systems

▪ Battery management systems (BMS)

Track 5: Emerging Technologies & Applications

▪ Quantum computing devices

▪ Bioelectronics and implantable devices

▪ Wearable and IoT sensor technologies

Track 6: Device Modeling, Fabrication & Reliability

▪ Circuits, Devices and Systems

▪ Compact modeling of electron devices

▪ Process simulation and TCAD tools

For more topics, please visit: https://www.iceda.org/cfp.html.

◆Submission Instructions

- English is the official language. Paper should be written and presented only in English.

- If you want to make a presentation and publish your paper, submit a full paper (no less than 5 pages, two-column); just want to make a presentation, abstract (200-400 words) is enough.

- If the length of the full paper exceeds 6 pages, extra page will be charged at 60 USD/400 RMB/Page.

- Submission:

1) By online submission system: https://confsys.iconf.org/submission/iceda2025

2) By Email: icedaconfvip.163.com

3) Template: Please format your paper according to the template (https://www.iceda.org/download/IOP-Template.doc) before submission.

◆Contact us

Conference secretary: Miss Adela Zhong

Email: iceda_contact163.com

Tel: +86-19180927671

Website: https://www.iceda.org/

Office Hours: 9:30--18:00, Monday to Friday (GMT+8 Time Zone)