Description

Publication The registered and presented papers will be published in Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus. Publication History ICSMM 2021 Materials Science Forum-ISBN: 978-3-0364-0024-2 (publication in progress...) ICSMM 2020 Key Engineering Materials: Volume 891. [ISBN: 978-3-0357-1789-1] (Ei Compendex & Scopus) ICSMM 2019 Solid State Phenomena: Volume 305. [ISBN: 978-3-0357-1657-3] (Ei Compendex & Scopus) ICSMM 2018 Material Science Forum: Volume 962. [ISBN: 978-3-0357-1416-6] (Ei Compendex & Scopus) ICSMM 2017 IOP Conference Series: Materials Science and Engineering, VoL.311. (Ei Compendex & Scopus)

Call For Papers

Submission Methods

Two kinds of proposals are accepted: Abstract for oral presenation & Full paper for publication and oral presentation.(English Only)

* System submission: http://confsys.iconf.org/submission/icsmm2022

* Email submission: icsmmcbees.net

For submission guidline, please visit: http://www.icsmm.org/sub.html

Conference Topics

* New Materials and Advanced Materials

* Electronic Materials

* Sensor Technology

* Materials Processing Engineering

* Material Chemistry

* Manufacturing Processes and Systems

For more topics, please visit: http://www.icsmm.org/cfp.html

Contact us

Ms. Elva Zhang

Tel: +86-28-87577778

E-mail: icsmmcbees.net

Website: www.icsmm.org