Proceedings:
The submitted full papers will be peer-reviewed, accepted and registered full papers will be published into Key Engineering Materials (ISSN: 1662-9795) published by TTP.
It will be sent for major indexing, such as 【EI Compendex, Scopus】
Call For Papers
Conference Chairs:
Reza Abbaschian, University of California, Riverside, USA
Xiaoqing Pan, University of California, Irvine, USA
Shu Yin, Tohoku University, Japan
Program Chairs:
Xiongqi Peng, Shanghai Jiao Tong University, China
Xiaoyan Song, Beijing University of Technology, China
Hai M. Duong, National University of Singapore, Singapore
Publication Chair:
Xuelin Lei, East China University of Science and Technology, China
Technical Committee:
Chao-Ming Lin, National Chiayi University, Taiwan
Mohamed Abdel Kader Ismail El-Gelany, Curtin University Sarawak Malaysia, Malaysia
Mohd Hasmizam Razali, Universiti Malaysia Terengganu, Malaysia
Eriki Ananda. K, VEMU Institute of Technology, India
Fazlena Hamzah, University Technology MARA, Malaysia
TeoMing Ting, Malaysian Nuclear Agency (Nuclear Malaysia) Bangi, Malaysia
Kim Yeow TSHAI, University of Nottingham Malaysia Campus, Malaysia
V. Sivaraman, EGS Pillay Engineering College, India
Ping Xiang, City University of Hong Kong, Hong Kong
Saiful Izwan Abd Razak, Universiti Teknologi Malaysia, Malaysia
Nongluck Houngkamhang, King Mongkut Institute of Technology Ladkrabang, Thailand
Keynote Speakers:
Prof. LU Li, National University of Singapore, Singapore
Prof. Shu Yin, Tohoku University, Japan
Prof. Jinshu Wang, Beijing University of Technology, China